ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,662, issued on Oct. 27, was assigned to STMICROELECTRONICS (TOURS) SAS (Tours, France). "Method of fabricating a capacitor" was invented by... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,663, issued on Oct. 27, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device and semiconductor module" was invented by Bungo... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,664, issued on Oct. 27, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Thin film resistor mismatch improvement using a self-aligned doub... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,665, issued on Oct. 27, was assigned to Semiconductor Manufacturing International (Shanghai) Corp. (Shanghai). "Semiconductor structure and... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,666, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices including capacitor st... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,667, issued on Oct. 27, was assigned to MediaTek Inc. (Hsinchu City, Taiwan). "Semiconductor structure of bipolar junction transistor (BJT)... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,668, issued on Oct. 27, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.). "Epitaxial field stop region for semic... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,669, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and manufa... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,670, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and met... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,671, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Isolation structures for multi-... Read More